Abstract Nanofabrication in silicon, arguably the most important material for modern technology, has been limited exclusively to its surface. Existing lithography methods cannot penetrate the wafer surface without altering it, whereas emerging laser-based subsurface or in-chip fabrication remains at greater than 1 μm resolution. In addition, available methods do not allow positioning or modulation with sub-micron precision deep inside the wafer. The fundamental difficulty of breaking these dimensional barriers is two-fold, i.e., complex nonlinear effects inside the wafer and the inherent diffraction limit for laser light. Here, we overcome these challenges by exploiting spatially-modulated laser beams and anisotropic feedback from preformed subsurface structures, to establish controlled nanofabrication capability inside silicon. We demonstrate buried nanostructures of feature sizes down to 100 ± 20 nm, with subwavelength and multi-dimensional control; thereby improving the state-of-the-art by an order-of-magnitude. In order to showcase the emerging capabilities, we fabricate nanophotonics elements deep inside Si, exemplified by nanogratings with record diffraction efficiency and spectral control. The reported advance is an important step towards 3D nanophotonics systems, micro/nanofluidics, and 3D electronic-photonic integrated systems.
Find this article in full text from Springer Verlag. 
Full Text Finder