دورية أكاديمية

H2 Plasma and PMA Effects on PEALD-Al2O3 Films with Different O2 Plasma Exposure Times for CIS Passivation Layers

التفاصيل البيبلوغرافية
العنوان: H2 Plasma and PMA Effects on PEALD-Al2O3 Films with Different O2 Plasma Exposure Times for CIS Passivation Layers
المؤلفون: Jehyun An, Kyeongkeun Choi, Jongseo Park, Bohyeon Kang, Hyunseo You, Sungmin Ahn, Rockhyun Baek
المصدر: Nanomaterials, Vol 13, Iss 4, p 731 (2023)
بيانات النشر: MDPI AG, 2023.
سنة النشر: 2023
المجموعة: LCC:Chemistry
مصطلحات موضوعية: high-k gate dielectric, Al2O3, H2 plasma treatment, interface trap, plasma-enhanced atomic layer deposition, Chemistry, QD1-999
الوصف: In this study, the electrical properties of Al2O3 film were analyzed and optimized to improve the properties of the passivation layer of CMOS image sensors (CISs). During Al2O3 deposition processing, the O2 plasma exposure time was adjusted, and H2 plasma treatment as well as post-metallization annealing (PMA) were performed as posttreatments. The flat-band voltage (Vfb) was significantly shifted (ΔVfb = 2.54 V) in the case of the Al2O3 film with a shorter O2 plasma exposure time; however, with a longer O2 plasma exposure time, Vfb was slightly shifted (ΔVfb = 0.61 V) owing to the reduction in the carbon impurity content. Additionally, the as-deposited Al2O3 sample with a shorter O2 plasma exposure time had a larger number of interface traps (interface trap density, Dit = 8.98 × 1013 eV−1·cm−2). However, Dit was reduced to 1.12 × 1012 eV−1·cm−2 by increasing the O2 plasma exposure time and further reduced after PMA. Consequently, we fabricated an Al2O3 film suitable for application as a CIS passivation layer with a reduced number of interface traps. However, the Al2O3 film with increased O2 plasma exposure time deteriorated owing to plasma damage after H2 plasma treatment, which is a method of reducing carbon impurity content. This deterioration was validated using the C–V hump and breakdown characteristics.
نوع الوثيقة: article
وصف الملف: electronic resource
اللغة: English
تدمد: 13040731
2079-4991
Relation: https://www.mdpi.com/2079-4991/13/4/731; https://doaj.org/toc/2079-4991
DOI: 10.3390/nano13040731
URL الوصول: https://doaj.org/article/c12a845cacd04989849dfd0fd8433f38
رقم الأكسشن: edsdoj.12a845cacd04989849dfd0fd8433f38
قاعدة البيانات: Directory of Open Access Journals
الوصف
تدمد:13040731
20794991
DOI:10.3390/nano13040731