دورية أكاديمية
Novel fabrication techniques for ultra-thin silicon based flexible electronics
| العنوان: | Novel fabrication techniques for ultra-thin silicon based flexible electronics |
|---|---|
| المؤلفون: | Ju Young Lee, Jeong Eun Ju, Chanwoo Lee, Sang Min Won, Ki Jun Yu |
| المصدر: | International Journal of Extreme Manufacturing, Vol 6, Iss 4, p 042005 (2024) |
| بيانات النشر: | IOP Publishing, 2024. |
| سنة النشر: | 2024 |
| المجموعة: | LCC:Materials of engineering and construction. Mechanics of materials LCC:Industrial engineering. Management engineering LCC:Physics |
| مصطلحات موضوعية: | flexible electronics, silicon fabrication technique, top-down approach, bottom-up approach, Materials of engineering and construction. Mechanics of materials, TA401-492, Industrial engineering. Management engineering, T55.4-60.8, Physics, QC1-999 |
| الوصف: | Flexible electronics offer a multitude of advantages, such as flexibility, lightweight property, portability, and high durability. These unique properties allow for seamless applications to curved and soft surfaces, leading to extensive utilization across a wide range of fields in consumer electronics. These applications, for example, span integrated circuits, solar cells, batteries, wearable devices, bio-implants, soft robotics, and biomimetic applications. Recently, flexible electronic devices have been developed using a variety of materials such as organic, carbon-based, and inorganic semiconducting materials. Silicon (Si) owing to its mature fabrication process, excellent electrical, optical, thermal properties, and cost efficiency, remains a compelling material choice for flexible electronics. Consequently, the research on ultra-thin Si in the context of flexible electronics is studied rigorously nowadays. The thinning of Si is crucially important for flexible electronics as it reduces its bending stiffness and the resultant bending strain, thereby enhancing flexibility while preserving its exceptional properties. This review provides a comprehensive overview of the recent efforts in the fabrication techniques for forming ultra-thin Si using top-down and bottom-up approaches and explores their utilization in flexible electronics and their applications. |
| نوع الوثيقة: | article |
| وصف الملف: | electronic resource |
| اللغة: | English |
| تدمد: | 2631-7990 |
| Relation: | https://doaj.org/toc/2631-7990 |
| DOI: | 10.1088/2631-7990/ad492e |
| URL الوصول: | https://doaj.org/article/1e028845359e4dae9f5a50eb3562dd31 |
| رقم الأكسشن: | edsdoj.1e028845359e4dae9f5a50eb3562dd31 |
| قاعدة البيانات: | Directory of Open Access Journals |
Full Text Finder | تدمد: | 26317990 |
|---|---|
| DOI: | 10.1088/2631-7990/ad492e |