دورية أكاديمية
Enhancing the Thermal Resistance of UV-Curable Resin Using (3-Thiopropyl)polysilsesquioxane
| العنوان: | Enhancing the Thermal Resistance of UV-Curable Resin Using (3-Thiopropyl)polysilsesquioxane |
|---|---|
| المؤلفون: | Daria Pakuła, Bogna Sztorch, Monika Topa-Skwarczyńska, Karolina Gałuszka, Joanna Ortyl, Bogdan Marciniec, Robert E. Przekop |
| المصدر: | Materials, Vol 17, Iss 10, p 2219 (2024) |
| بيانات النشر: | MDPI AG, 2024. |
| سنة النشر: | 2024 |
| المجموعة: | LCC:Technology LCC:Electrical engineering. Electronics. Nuclear engineering LCC:Engineering (General). Civil engineering (General) LCC:Microscopy LCC:Descriptive and experimental mechanics |
| مصطلحات موضوعية: | (3-thiopropyl)polysilsesquioxane, urethane-acrylate resin, composites, thermal properties, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85 |
| الوصف: | This study delineates a methodology for the preparation of new composites based on a photocurable urethane-acrylate resin, which has been modified with (3-thiopropyl)polysilsesquioxane (SSQ-SH). The organosilicon compound combines fully enclosed cage structures and incompletely condensed silanols (a mixture of random structures) obtained through the hydrolytic condensation of (3-mercaptopropyl)trimethoxysilane. This process involves a thiol-ene “click” reaction between SSQ-SH and a commercially available resin (Ebecryl 1271®) in the presence of the photoinitiator DMPA, resulting in composites with significantly changed thermal properties. Various tests were conducted, including thermogravimetric analysis (TGA), Fourier transmittance infrared spectroscopy (FT-IR), differential scanning calorimetry (Photo-DSC), and photoreological measurement mechanical property, and water contact angle (WCA) tests. The modification of resin with SSQ-SH increased the temperature of 1% and 5% mass loss compared to the reference (for 50 wt% SSQ-SH, T5% was 310.8 °C, an increase of 20.4 °C). A composition containing 50 wt% of SSQ-SH crosslinked faster than the reference resin, a phenomenon confirmed by photorheological tests. This research highlights the potential of new composite materials in coating applications across diverse industries. The modification of resin with SSQ-SH not only enhances thermal properties but also introduces a host of functional improvements, thereby elevating the performance of the resulting coatings. |
| نوع الوثيقة: | article |
| وصف الملف: | electronic resource |
| اللغة: | English |
| تدمد: | 17102219 1996-1944 |
| Relation: | https://www.mdpi.com/1996-1944/17/10/2219; https://doaj.org/toc/1996-1944 |
| DOI: | 10.3390/ma17102219 |
| URL الوصول: | https://doaj.org/article/a254904e449f481a840598b8013c333e |
| رقم الأكسشن: | edsdoj.254904e449f481a840598b8013c333e |
| قاعدة البيانات: | Directory of Open Access Journals |
Full Text Finder | تدمد: | 17102219 19961944 |
|---|---|
| DOI: | 10.3390/ma17102219 |