دورية أكاديمية

Fabrication and characterization of resistive double square loop arrays for ultra-wide bandwidth microwave absorption

التفاصيل البيبلوغرافية
العنوان: Fabrication and characterization of resistive double square loop arrays for ultra-wide bandwidth microwave absorption
المؤلفون: Ji-Young Jeong, Je-Ryung Lee, Hyeonjin Park, Joonkyo Jung, Doo-Sun Choi, Eun-chae Jeon, Jonghwa Shin, Jun Sae Han, Tae-Jin Je
المصدر: Scientific Reports, Vol 11, Iss 1, Pp 1-12 (2021)
بيانات النشر: Nature Portfolio, 2021.
سنة النشر: 2021
المجموعة: LCC:Medicine
LCC:Science
مصطلحات موضوعية: Medicine, Science
الوصف: Abstract Microwave absorbers using conductive ink are generally fabricated by printing an array pattern on a substrate to generate electromagnetic fields. However, screen printing processes are difficult to vary the sheet resistance values for different regions of the pattern on the same layer, because the printing process deposits materials at the same height over the entire surface of substrate. In this study, a promising manufacturing process was suggested for engraved resistive double square loop arrays with ultra-wide bandwidth microwave. The developed manufacturing process consists of a micro-end-milling, inking, and planing processes. A 144-number of double square loop array was precisely machined on a polymethyl methacrylate workpiece with the micro-end-milling process. After engraving array structures, the machined surface was completely covered with the developed conductive carbon ink with a sheet resistance of 15 Ω/sq. It was cured at room temperature. Excluding the ink that filled the machined double square loop array, overflowed ink was removed with the planing process to achieve full filled and isolated resistive array patterns. The fabricated microwave absorber showed a small radar cross-section with reflectance less than − 10 dB in the frequency band range of 8.0–14.6 GHz.
نوع الوثيقة: article
وصف الملف: electronic resource
اللغة: English
تدمد: 2045-2322
69986215
Relation: https://doaj.org/toc/2045-2322
DOI: 10.1038/s41598-021-91868-y
URL الوصول: https://doaj.org/article/ee28a9b9084f4ee699862156407c6b75
رقم الأكسشن: edsdoj.28a9b9084f4ee699862156407c6b75
قاعدة البيانات: Directory of Open Access Journals
الوصف
تدمد:20452322
69986215
DOI:10.1038/s41598-021-91868-y