دورية أكاديمية

Microwave Frequency Offset Induced by Subsurface Damage in Abrasive-Machined Semiconductor Ceramic Waveguide

التفاصيل البيبلوغرافية
العنوان: Microwave Frequency Offset Induced by Subsurface Damage in Abrasive-Machined Semiconductor Ceramic Waveguide
المؤلفون: Haoji Wang, Jinhua Wei, Bin Lin, Xiaoqi Cui, Hetian Hou, Zhiyuan Fu, Jianchun Ding, Tianyi Sui
المصدر: Machines, Vol 11, Iss 12, p 1057 (2023)
بيانات النشر: MDPI AG, 2023.
سنة النشر: 2023
المجموعة: LCC:Mechanical engineering and machinery
مصطلحات موضوعية: ceramic metallization, ceramic waveguide filter, frequency control, microwave dielectric ceramic, mm wave resonator, resonant frequency, Mechanical engineering and machinery, TJ1-1570
الوصف: Ceramic waveguide components play a critical role in modern microwave semiconductor systems. For the first time, this work reports experimental results obtained when dielectric ceramics are abrasive-machined into waveguide components. This process will cause subsurface damage (SSD), resulting in a deviation in their working frequency which can degrade the performance of the system. For a substrate-integrated waveguide (SIW) resonator working at 10.1 GHz, SSD with a depth of 89 um can cause a maximum frequency offset of 20.2%. For a mm wave component working at 70 GHz, the corresponding frequency offset could increase to 169%. Three resonator SIW filters with SSD are studied, and the results demonstrate that the frequency offset induced by SSD can reduce the pass rate of the filters from 95.4% to 0%. A theoretical analysis is performed to reveal the mechanism and to offer a quantitative estimation of the limiting range of the offset caused by SSD. Feasible methods for reducing the offset caused by SSD, such as structure design, processing optimization, and material reinforcement, are discussed.
نوع الوثيقة: article
وصف الملف: electronic resource
اللغة: English
تدمد: 2075-1702
Relation: https://www.mdpi.com/2075-1702/11/12/1057; https://doaj.org/toc/2075-1702
DOI: 10.3390/machines11121057
URL الوصول: https://doaj.org/article/31b50833951f418895ec6f99cbd1a234
رقم الأكسشن: edsdoj.31b50833951f418895ec6f99cbd1a234
قاعدة البيانات: Directory of Open Access Journals
الوصف
تدمد:20751702
DOI:10.3390/machines11121057