دورية أكاديمية

Degradation Study of Thin-Film Silicon Structures in a Cell Culture Medium

التفاصيل البيبلوغرافية
العنوان: Degradation Study of Thin-Film Silicon Structures in a Cell Culture Medium
المؤلفون: Huachun Wang, Jingjing Tian, Bingwei Lu, Yang Xie, Pengcheng Sun, Lan Yin, Yuguang Wang, Xing Sheng
المصدر: Sensors, Vol 22, Iss 3, p 802 (2022)
بيانات النشر: MDPI AG, 2022.
سنة النشر: 2022
المجموعة: LCC:Chemical technology
مصطلحات موضوعية: thin-film silicon, cell culture medium, biodegradation, transient electronics, biocompatibility, Chemical technology, TP1-1185
الوصف: Thin-film silicon (Si)-based transient electronics represents an emerging technology that enables spontaneous dissolution, absorption and, finally, physical disappearance in a controlled manner under physiological conditions, and has attracted increasing attention in pertinent clinical applications such as biomedical implants for on-body sensing, disease diagnostics, and therapeutics. The degradation behavior of thin-film Si materials and devices is critically dependent on the device structure as well as the environment. In this work, we experimentally investigated the dissolution of planar Si thin films and micropatterned Si pillar arrays in a cell culture medium, and systematically analyzed the evolution of their topographical, physical, and chemical properties during the hydrolysis. We discovered that the cell culture medium significantly accelerates the degradation process, and Si pillar arrays present more prominent degradation effects by creating rougher surfaces, complicating surface states, and decreasing the electrochemical impedance. Additionally, the dissolution process leads to greatly reduced mechanical strength. Finally, in vitro cell culture studies demonstrate desirable biocompatibility of corroded Si pillars. The results provide a guideline for the use of thin-film Si materials and devices as transient implants in biomedicine.
نوع الوثيقة: article
وصف الملف: electronic resource
اللغة: English
تدمد: 1424-8220
Relation: https://www.mdpi.com/1424-8220/22/3/802; https://doaj.org/toc/1424-8220
DOI: 10.3390/s22030802
URL الوصول: https://doaj.org/article/a4e5ee3ea4194cc09ba081dd5f1d9bf9
رقم الأكسشن: edsdoj.4e5ee3ea4194cc09ba081dd5f1d9bf9
قاعدة البيانات: Directory of Open Access Journals
الوصف
تدمد:14248220
DOI:10.3390/s22030802