دورية أكاديمية

RF characteristics of 150‐nm AlGaN/GaN high electron mobility transistors fabricated using i‐line stepper lithography

التفاصيل البيبلوغرافية
العنوان: RF characteristics of 150‐nm AlGaN/GaN high electron mobility transistors fabricated using i‐line stepper lithography
المؤلفون: Yuji Ando, Hidemasa Takahashi, Ryutaro Makisako, Akio Wakejima, Jun Suda
المصدر: Electronics Letters, Vol 59, Iss 10, Pp n/a-n/a (2023)
بيانات النشر: Wiley, 2023.
سنة النشر: 2023
المجموعة: LCC:Electrical engineering. Electronics. Nuclear engineering
مصطلحات موضوعية: high electron mobility transistors, microwave amplifiers, millimetre‐wave amplifiers, wide band gap semiconductors, Electrical engineering. Electronics. Nuclear engineering, TK1-9971
الوصف: Abstract This article reports radio frequency characteristics of 150‐nm gate aluminum gallium nitride (AlGaN)/gallium nitride (GaN) high electron mobility transistors (HEMTs) fabricated using i‐line stepper lithography and a thermal reflow technique. The authors have developed two different gate structures that were a field‐plated gate using the lift‐off process and a Y‐shaped gate using the ion‐milling process. Fabricated HEMTs using these different gate structures exhibited nearly equivalent DC characteristics. The field‐plated gate device showed a unity current gain cutoff frequency (fT) of 35 GHz and a maximum oscillation frequency (fmax) of 106 GHz, while the Y‐shaped gate device showed fT of 36 GHz and fmax of 115 GHz. The equivalent circuit analysis indicated a decrease in the gate‐drain capacitance and the drain conductance is responsible for the improved fmax in the Y‐shaped gate device.
نوع الوثيقة: article
وصف الملف: electronic resource
اللغة: English
تدمد: 1350-911X
0013-5194
Relation: https://doaj.org/toc/0013-5194; https://doaj.org/toc/1350-911X
DOI: 10.1049/ell2.12798
URL الوصول: https://doaj.org/article/acd56a6c3924475d95f28c55cc4575c8
رقم الأكسشن: edsdoj.56a6c3924475d95f28c55cc4575c8
قاعدة البيانات: Directory of Open Access Journals
الوصف
تدمد:1350911X
00135194
DOI:10.1049/ell2.12798