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A comprehensive packaging solution from DC to 113 GHz for InGaAs amplifiers

التفاصيل البيبلوغرافية
العنوان: A comprehensive packaging solution from DC to 113 GHz for InGaAs amplifiers
المؤلفون: Luca Valenziano, Joachim Hebeler, Alban Sherifaj, Fabian Thome, Christian Koos, Thomas Zwick, Akanksha Bhutani
المصدر: Electronics Letters, Vol 60, Iss 6, Pp n/a-n/a (2024)
بيانات النشر: Wiley, 2024.
سنة النشر: 2024
المجموعة: LCC:Electrical engineering. Electronics. Nuclear engineering
مصطلحات موضوعية: millimetre wave amplifiers, millimetre waves, packaging, Electrical engineering. Electronics. Nuclear engineering, TK1-9971
الوصف: Abstract This letter presents the design, fabrication and measurement of a 72 kHz to 113 GHz ultra‐broadband amplifier that includes a direct current (DC)‐blocking functionality. This amplifier module stands out with a high average gain of 12.5 dB in the frequency range from almost DC to 110 GHz. This work not only combines electrical interconnections but also mechanical design considerations, thermal requirements and practical application specific aspects. To ensure a low thermal resistance, the InGaAs amplifier IC is directly mounted on an aluminium submount, applying an advanced gluing concept, and interconnected to an input and output 50 Ω grounded coplanar waveguide by wire bonds with a length of only 135 μm. To enable convenient usage of the package, 1 mm connectors are utilized. This amplifier module exhibits excellent thermal behaviour and group delay characteristics, making it an ideal choice for use in optical data transmission experiments.
نوع الوثيقة: article
وصف الملف: electronic resource
اللغة: English
تدمد: 1350-911X
0013-5194
Relation: https://doaj.org/toc/0013-5194; https://doaj.org/toc/1350-911X
DOI: 10.1049/ell2.13143
URL الوصول: https://doaj.org/article/58b312fd1d414f2a80fb969f66ce2332
رقم الأكسشن: edsdoj.58b312fd1d414f2a80fb969f66ce2332
قاعدة البيانات: Directory of Open Access Journals
الوصف
تدمد:1350911X
00135194
DOI:10.1049/ell2.13143