دورية أكاديمية
Improved thermal stability of SiCf/SiC ceramic matrix composites fabricated by PIP process
العنوان: | Improved thermal stability of SiCf/SiC ceramic matrix composites fabricated by PIP process |
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المؤلفون: | Gu Jian, Lee Sea-Hoon, Kim Daejong, Lee Hee-Soo, Kim Jun-Seop |
المصدر: | Processing and Application of Ceramics, Vol 15, Iss 2, Pp 164-169 (2021) |
بيانات النشر: | University of Novi Sad, 2021. |
سنة النشر: | 2021 |
المجموعة: | LCC:Clay industries. Ceramics. Glass |
مصطلحات موضوعية: | sicf/sic cmc, pip, sic filler, thermal stability, Clay industries. Ceramics. Glass, TP785-869 |
الوصف: | Improvement of the thermal stability of continuous SiC fiber reinforced SiC ceramic matrix composites (SiCf/SiC CMC) by the pre-treatment of SiC fillers and the suppression of oxidation during polymer impregnation and pyrolysis (PIP) process were investigated. Dense SiCf/SiC CMCs were fabricated using the slurry infiltration and PIP process under a purified argon atmosphere. Structure and mechanical properties of the SiCf/SiC CMC heated at different temperatures were evaluated. The flexural strength of the SiCf/SiC CMC decreased only 15.3%after heating at 1400 °C, which exhibited a clear improvement compared with the literature data (49.5% loss), where severe thermal deterioration of SiCf/SiC composite occurred at high temperatures by the crystallization and decomposition of the precursor-derived ceramic matrix. The thermal stability of the SiCf/SiC CMC fabricated by PIP process was improved by the pre-treatment of SiC fillers for removing oxides and the strict atmosphere control to prevent oxidation. |
نوع الوثيقة: | article |
وصف الملف: | electronic resource |
اللغة: | English |
تدمد: | 1820-6131 2406-1034 |
Relation: | https://doaj.org/toc/1820-6131; https://doaj.org/toc/2406-1034 |
DOI: | 10.2298/PAC2102164G |
URL الوصول: | https://doaj.org/article/6718f1365e394f2991f57712eee9482d |
رقم الأكسشن: | edsdoj.6718f1365e394f2991f57712eee9482d |
قاعدة البيانات: | Directory of Open Access Journals |
تدمد: | 18206131 24061034 |
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DOI: | 10.2298/PAC2102164G |