دورية أكاديمية
Highly Stretchable Shape Memory Self-Soldering Conductive Tape with Reversible Adhesion Switched by Temperature
| العنوان: | Highly Stretchable Shape Memory Self-Soldering Conductive Tape with Reversible Adhesion Switched by Temperature |
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| المؤلفون: | Mengyan Wang, Quan Zhang, Yiwen Bo, Chunyang Zhang, Yiwen Lv, Xiang Fu, Wen He, Xiangqian Fan, Jiajie Liang, Yi Huang, Rujun Ma, Yongsheng Chen |
| المصدر: | Nano-Micro Letters, Vol 13, Iss 1, Pp 1-11 (2021) |
| بيانات النشر: | SpringerOpen, 2021. |
| سنة النشر: | 2021 |
| المجموعة: | LCC:Technology |
| مصطلحات موضوعية: | Shape memory performance, Self-soldering conductive tape, Reversible adhesion, Stretchable electronics, Technology |
| الوصف: | Highlights Shape memory self-soldering tape used as conductive interconnecting material. Perfect shape and conductivity memory performance and anti-fatigue performance. Reversible strong-to-weak adhesion switched by temperature. Abstract With practical interest in the future applications of next-generation electronic devices, it is imperative to develop new conductive interconnecting materials appropriate for modern electronic devices to replace traditional rigid solder tin and silver paste of high melting temperature or corrosive solvent requirements. Herein, we design highly stretchable shape memory self-soldering conductive (SMSC) tape with reversible adhesion switched by temperature, which is composed of silver particles encapsulated by shape memory polymer. SMSC tape has perfect shape and conductivity memory property and anti-fatigue ability even under the strain of 90%. It also exhibits an initial conductivity of 2772 S cm−1 and a maximum tensile strain of ~ 100%. The maximum conductivity could be increased to 5446 S cm−1 by decreasing the strain to 17%. Meanwhile, SMSC tape can easily realize a heating induced reversible strong-to-weak adhesion transition for self-soldering circuit. The combination of stable conductivity, excellent shape memory performance, and temperature-switching reversible adhesion enables SMSC tape to serve two functions of electrode and solder simultaneously. This provides a new way for conductive interconnecting materials to meet requirements of modern electronic devices in the future. |
| نوع الوثيقة: | article |
| وصف الملف: | electronic resource |
| اللغة: | English |
| تدمد: | 2311-6706 2150-5551 |
| Relation: | https://doaj.org/toc/2311-6706; https://doaj.org/toc/2150-5551 |
| DOI: | 10.1007/s40820-021-00652-0 |
| URL الوصول: | https://doaj.org/article/9f7a73756a5a436ab612e5e4f83138ef |
| رقم الأكسشن: | edsdoj.9f7a73756a5a436ab612e5e4f83138ef |
| قاعدة البيانات: | Directory of Open Access Journals |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 23116706 21505551 |
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| DOI: | 10.1007/s40820-021-00652-0 |