دورية أكاديمية
Round-robin measurement of surface tension of high-temperature liquid platinum free of oxygen adsorption by oscillating droplet method using levitation techniques
العنوان: | Round-robin measurement of surface tension of high-temperature liquid platinum free of oxygen adsorption by oscillating droplet method using levitation techniques |
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المؤلفون: | Seimiya Yusaku, Tomita Shuto, Kawaguchi Tohei, Kobatake Hidekazu, Brillo Jürgen, Shiratori Suguru, Sugioka Ken-ichi, Ishikawa Takehiko, Ozawa Shumpei |
المصدر: | High Temperature Materials and Processes, Vol 42, Iss 1, Pp pp. 2796-2801 (2023) |
بيانات النشر: | De Gruyter, 2023. |
سنة النشر: | 2023 |
المجموعة: | LCC:Technology LCC:Chemical technology LCC:Chemicals: Manufacture, use, etc. |
مصطلحات موضوعية: | high temperature melt, thermophysical properties, electrostatic levitation, electromagnetic levitation, aerodynamics levitation, Technology, Chemical technology, TP1-1185, Chemicals: Manufacture, use, etc., TP200-248 |
الوصف: | Round-robin measurement of surface tension of high-temperature liquid platinum was conducted free of any contamination from the supporting materials and oxygen adsorption, using an electrostatic levitator (ESL), two electromagnetic levitator (EML), and an aerodynamic levitator (ADL). The measured temperature dependences of the surface tension using ESL and two EMLs were in good agreement and were expressed as σ=1,798±74.3−(0.12±0.0445)×(T−2,041)\sigma =\mathrm{1,798}\pm 74.3-(0.12\pm 0.0445)\times (T-\mathrm{2,041}) [10–3 N·m–1] (1,900–2,600 K). However, the surface tension values measured with ADL were slightly lower than those exceeding the uncertainty of the measurement plots at high temperatures. |
نوع الوثيقة: | article |
وصف الملف: | electronic resource |
اللغة: | English |
تدمد: | 2191-0324 |
Relation: | https://doaj.org/toc/2191-0324 |
DOI: | 10.1515/htmp-2022-0306 |
URL الوصول: | https://doaj.org/article/cbf37b7be886487cb5ab880372b99007 |
رقم الأكسشن: | edsdoj.bf37b7be886487cb5ab880372b99007 |
قاعدة البيانات: | Directory of Open Access Journals |
تدمد: | 21910324 |
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DOI: | 10.1515/htmp-2022-0306 |