دورية أكاديمية

Influence of flexible molecular structure on the cryogenic mechanical properties of epoxy matrix and carbon fiber/epoxy composite laminate

التفاصيل البيبلوغرافية
العنوان: Influence of flexible molecular structure on the cryogenic mechanical properties of epoxy matrix and carbon fiber/epoxy composite laminate
المؤلفون: Shichao Li, Duo Chen, Yuhuan Yuan, Chang Gao, Yunguang Cui, Hongyu Wang, Xin Liu, Minjing Liu, Zhanjun Wu
المصدر: Materials & Design, Vol 195, Iss , Pp 109028- (2020)
بيانات النشر: Elsevier, 2020.
سنة النشر: 2020
المجموعة: LCC:Materials of engineering and construction. Mechanics of materials
مصطلحات موضوعية: Composite laminate, Epoxy resin, Toughness, Cryogenic mechanical properties, Thermal cycling, Materials of engineering and construction. Mechanics of materials, TA401-492
الوصف: In this study, a flexible polymer (polysiloxane) containing SiOSi molecular chains and epoxy groups (EPSE) was prepared. The effect of EPSE on the cryogenic mechanical properties of epoxy matrix and carbon fiber (CF) reinforced epoxy composite laminate was investigated in detail. At RT, with an EPSE content of 8 wt%, the failure strain and fracture toughness KIC value of epoxy resin was improved by 69.4% and 10.4%, respectively. At cryogenic temperature, the tensile strength, failure strain and KIC value of EPSE-epoxy reached a maximum of 207 MPa, 3.13%, and 2.60 MPa·m1/2, respectively. Micro-morphology of the fracture surface indicated that the incorporation of EPSE improved the resistance to crack growth. The flexural strength of CF/EPSE-epoxy laminate at 77 K was 17.2% higher than that of CF/neat epoxy laminate, which mainly attributed to the flexible SiOSi molecular chains in EPSE reducing the CF/matrix interface thermal stress. The transition of failure mode resulted in the jagged-shape load fluctuations in the load-displacement curves of laminates at 77 K. Thermal cycling affecting the flexural strength of CF/EPSE-epoxy laminate was mainly ascribed to the release of part of thermal residual stress and the formation of interface debonding.
نوع الوثيقة: article
وصف الملف: electronic resource
اللغة: English
تدمد: 0264-1275
Relation: http://www.sciencedirect.com/science/article/pii/S0264127520305633; https://doaj.org/toc/0264-1275
DOI: 10.1016/j.matdes.2020.109028
URL الوصول: https://doaj.org/article/f08fa682b61f4cdfbe0bc316861907a8
رقم الأكسشن: edsdoj.f08fa682b61f4cdfbe0bc316861907a8
قاعدة البيانات: Directory of Open Access Journals
الوصف
تدمد:02641275
DOI:10.1016/j.matdes.2020.109028