دورية أكاديمية
Large‐Area Flexible Thin Film Encapsulation with High Barrier and Super‐Hydrophobic Property
| العنوان: | Large‐Area Flexible Thin Film Encapsulation with High Barrier and Super‐Hydrophobic Property |
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| المؤلفون: | Chao Li, Shizhong Yue, Wang Tian, Yumin Ye, Jun Liu, Yanbin Huang, Zhitao Huang, Yulin Wu, Jiaqian Sun, Zeren Zhao, Keqian Dong, Kong Liu, Zhijie Wang, Shengchun Qu |
| المصدر: | Advanced Materials Interfaces, Vol 10, Iss 18, Pp n/a-n/a (2023) |
| بيانات النشر: | Wiley-VCH, 2023. |
| سنة النشر: | 2023 |
| المجموعة: | LCC:Physics LCC:Technology |
| مصطلحات موضوعية: | barrier film, conformability, super‐hydrophobic, thin film encapsulation, water‐sensitive, Physics, QC1-999, Technology |
| الوصف: | Abstract With the development of optoelectronic devices toward miniaturization, flexibility, and large‐scale integration, conventional submillimeter rigid encapsulation techniques rarely achieve conformational functionality while blocking water and oxygen. At the same time, the sensitivity of electronic devices with organic/metal/semiconductor components to humidity and oxygen severely impairs their operational stability and lifetime. Here, a nanometer to micrometer scale organic/inorganic hybrid thin film encapsulation (TFE) with the self‐cleaning ability for flexible encapsulation is developed. The water vapor transmittance rate of polyethylene terephthalate substrate coated with the TFE is as low as 1.65 × 10−4 g m−2 day−1, and the barrier improvement factor reaches 104 at 38 °C and 90% relative humidity. This value is equivalent to 9.81 × 10−6 g m−2 day−1 at ambient conditions, sufficient to improve the lifetime of water‐sensitive electronic devices. Meanwhile, this TFE shows a super‐hydrophobic performance, with a water contact angle of 168.4°. In addition, the resulting barrier films exhibit outstanding optical properties, with an average optical transmittance of 86.88% in the visible region. This versatile TFE can promote the development of optoelectronic devices toward miniaturization and large‐scale integration in the future. |
| نوع الوثيقة: | article |
| وصف الملف: | electronic resource |
| اللغة: | English |
| تدمد: | 2196-7350 94669465 |
| Relation: | https://doaj.org/toc/2196-7350 |
| DOI: | 10.1002/admi.202300172 |
| URL الوصول: | https://doaj.org/article/f64f2ff94669465d8402cf65e6346dd8 |
| رقم الأكسشن: | edsdoj.f64f2ff94669465d8402cf65e6346dd8 |
| قاعدة البيانات: | Directory of Open Access Journals |
Full Text Finder | تدمد: | 21967350 94669465 |
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| DOI: | 10.1002/admi.202300172 |