مؤتمر
Reverse Laser Assisted Bonding (R-LAB) Technology for Chiplet Module Bonding on Substrate
| العنوان: | Reverse Laser Assisted Bonding (R-LAB) Technology for Chiplet Module Bonding on Substrate |
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| المؤلفون: | Na, SeokHo, Gim, MinHo, Kim, GaHyeon, Ryu, DongSu, Park, DongJoo, Kim, JinYoung |
| المصدر: | 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :414-417 Dec, 2022 |
| Relation: | 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9798350398854 9798350398847 |
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| DOI: | 10.1109/EPTC56328.2022.10013158 |