مؤتمر
Laser Integration on Silicon through Flip-chip Bonding with Efficient Coupling
| العنوان: | Laser Integration on Silicon through Flip-chip Bonding with Efficient Coupling |
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| المؤلفون: | Chi, Ting Ta, Li, Nanxi, Cai, Hong, Li, Zhenyu, Tobing, Landobasa Y M, Yu, Haitao, Lee, Lennon Y. T., Lee, Wen |
| المصدر: | 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :138-141 Dec, 2022 |
| Relation: | 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9798350398854 9798350398847 |
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| DOI: | 10.1109/EPTC56328.2022.10013178 |