مؤتمر
Temperature Cycling Performance of Bi-doped Solder Ball Alloy on DRAM Module Form and Daisy-Chained Printed Circuit Board
| العنوان: | Temperature Cycling Performance of Bi-doped Solder Ball Alloy on DRAM Module Form and Daisy-Chained Printed Circuit Board |
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| المؤلفون: | Zou, Y. S., Chung, M. H., Gan, C. L., Chen, Jeremy, Hsu, Claire, Takiar, Hem |
| المصدر: | 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :567-569 Dec, 2022 |
| Relation: | 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9798350398854 9798350398847 |
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| DOI: | 10.1109/EPTC56328.2022.10013228 |