مؤتمر
Failure Analysis Case Study on Covalent Wafer bonding Delamination
| العنوان: | Failure Analysis Case Study on Covalent Wafer bonding Delamination |
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| المؤلفون: | Tang, L.J., Woo, Jasmine, Chew, Michelle, Lee, Kenneth, Chi, Ting Ta |
| المصدر: | 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :783-786 Dec, 2022 |
| Relation: | 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9798350398854 9798350398847 |
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| DOI: | 10.1109/EPTC56328.2022.10013251 |