مؤتمر
Board Level Life Assessment of Large Body Flip Chip Packages with Smaller Solder ball pitch & Methodologies to improve Board level Reliability
| العنوان: | Board Level Life Assessment of Large Body Flip Chip Packages with Smaller Solder ball pitch & Methodologies to improve Board level Reliability |
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| المؤلفون: | Ramasamy, Anandan, Singh, Inderjit, Ng, Ace, Low, Shin, Maloney, Gerry, Shao, Alan |
| المصدر: | 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :730-733 Dec, 2022 |
| Relation: | 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9798350398854 9798350398847 |
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| DOI: | 10.1109/EPTC56328.2022.10013257 |