مؤتمر
Non-Pressure Ag Sinter Paste without Residual Bleed-out: Studied on Different Au Based Substrates
| العنوان: | Non-Pressure Ag Sinter Paste without Residual Bleed-out: Studied on Different Au Based Substrates |
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| المؤلفون: | Seng, Audrey Long Wee, Yu, Liu, Shyan, Pang Hui, Murali, Sarangapani, Kumar, Balasubramanian Senthil, Sungsig, Kang SS |
| المصدر: | 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :392-396 Dec, 2022 |
| Relation: | 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9798350398854 9798350398847 |
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| DOI: | 10.1109/EPTC56328.2022.10013301 |