مؤتمر
Non-Pressure Ag Sinter Paste without Residual Bleed-out: Studied on Different Au Based Substrates
العنوان: | Non-Pressure Ag Sinter Paste without Residual Bleed-out: Studied on Different Au Based Substrates |
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المؤلفون: | Seng, Audrey Long Wee, Yu, Liu, Shyan, Pang Hui, Murali, Sarangapani, Kumar, Balasubramanian Senthil, Sungsig, Kang SS |
المصدر: | 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :392-396 Dec, 2022 |
Relation: | 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9798350398854 9798350398847 |
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DOI: | 10.1109/EPTC56328.2022.10013301 |