التفاصيل البيبلوغرافية
| العنوان: |
Advanced Substrate Packaging Technologies for Enabling Heterogeneous Integration (HI) Applications |
| المؤلفون: |
Duan, G., Kanaoka, Y., McRee, R., Li, Y., Liu, M. L., Yeon, H. S., Jones, J., Tanaka, H., May, A., Ranjan, R., Ozkan, O., Lehaf, A., Cho, S., Zhang, J., Manepalli, R., Mahajan, R., Azimi, H. |
| المصدر: |
2022 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2022 International. :3.4.1-3.4.4 Dec, 2022 |
| Relation: |
2022 IEEE International Electron Devices Meeting (IEDM) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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