التفاصيل البيبلوغرافية
| العنوان: |
25 nm iPMA-type Hexa-MTJ with solder reflow capability and endurance > 107 for eFlash-type MRAM |
| المؤلفون: |
Honjo, H., Nishioka, K., Miura, S., Naganuma, H., Watanabe, T., Nasuno, T., Tanigawa, T., Noguchi, Y., Inoue, H., Yasuhira, M., Ikeda, S., Endoh, T. |
| المصدر: |
2022 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2022 International. :10.3.1-10.3.4 Dec, 2022 |
| Relation: |
2022 IEEE International Electron Devices Meeting (IEDM) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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