Enabling Next Generation 3D Heterogeneous Integration Architectures on Intel Process

التفاصيل البيبلوغرافية
العنوان:	Enabling Next Generation 3D Heterogeneous Integration Architectures on Intel Process
المؤلفون:	Elsherbini, A., Jun, K., Liff, S., Talukdar, T., Bielefeld, J., Li, W., Vreeland, R., Niazi, H., Rawlings, B., Ajayi, T., Tsunoda, N., Hoff, T., Woods, C., Pasdast, G., Tiagaraj, S., Kabir, E., Shi, Y., Brezinski, W., Jordan, R., Ng, J., Brun, X., Krisnatreya, B., Liu, P., Zhang, B., Qian, Z., Goel, M., Swan, J., Yin, G., Pelto, C., Torres, J., Fischer, P.
المصدر:	2022 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2022 International. :27.3.1-27.3.4 Dec, 2022
Relation:	2022 IEEE International Electron Devices Meeting (IEDM)
قاعدة البيانات:	IEEE Xplore Digital Library