التفاصيل البيبلوغرافية
| العنوان: |
Insights into Scaled Logic Devices Connected from Both Wafer Sides |
| المؤلفون: |
Veloso, A., Eneman, G., Matagne, P., Vermeersch, B., Jourdain, A., Arimura, H., O'Sullivan, B., Chen, R., De Keersgieter, A., Simoen, E., Radisic, D., Oniki, Y., Laffitte, A., Brus, S., Beyne, E., Litta, E. Dentoni, Horiguchi, N. |
| المصدر: |
2022 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2022 International. :23.3.1-23.3.4 Dec, 2022 |
| Relation: |
2022 IEEE International Electron Devices Meeting (IEDM) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
Full Text Finder