مؤتمر
Hybrid Substrates for Chiplet Design and Heterogeneous Integration Packaging
| العنوان: | Hybrid Substrates for Chiplet Design and Heterogeneous Integration Packaging |
|---|---|
| المؤلفون: | Lau, J. H., Chen, G., Yang, C., Peng, A., Huang, J., Peng, C., Ko, C., Yang, H., Chen, Y., Tseng, T. |
| المصدر: | 2022 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2022 International. :3.5.1-3.5.4 Dec, 2022 |
| Relation: | 2022 IEEE International Electron Devices Meeting (IEDM) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781665489591 |
|---|---|
| تدمد: | 2156017X |
| DOI: | 10.1109/IEDM45625.2022.10019568 |