التفاصيل البيبلوغرافية
| العنوان: |
Finite Element Method for System-in-Package (SiP) Technology: Thermal Analysis Using Chip Cooling Laminate Chip (CCLC) |
| المؤلفون: |
Oukaira, Aziz, Said, Dhaou, Zbitou, Jamal, Lakhssassi, Ahmed |
| المصدر: |
2023 17th International Conference on Ubiquitous Information Management and Communication (IMCOM) Ubiquitous Information Management and Communication (IMCOM), 2023 17th International Conference on. :1-5 Jan, 2023 |
| Relation: |
2023 17th International Conference on Ubiquitous Information Management and Communication (IMCOM) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
