مؤتمر
Finite Element Method for System-in-Package (SiP) Technology: Thermal Analysis Using Chip Cooling Laminate Chip (CCLC)
العنوان: | Finite Element Method for System-in-Package (SiP) Technology: Thermal Analysis Using Chip Cooling Laminate Chip (CCLC) |
---|---|
المؤلفون: | Oukaira, Aziz, Said, Dhaou, Zbitou, Jamal, Lakhssassi, Ahmed |
المصدر: | 2023 17th International Conference on Ubiquitous Information Management and Communication (IMCOM) Ubiquitous Information Management and Communication (IMCOM), 2023 17th International Conference on. :1-5 Jan, 2023 |
Relation: | 2023 17th International Conference on Ubiquitous Information Management and Communication (IMCOM) |
قاعدة البيانات: | IEEE Xplore Digital Library |
كن أول من يترك تعليقا!