مؤتمر
Superfine flip-chip interconnection in 20/spl mu/m-pitch utilizing reliable microthin underfill technology for 3D stacked LSI
| العنوان: | Superfine flip-chip interconnection in 20/spl mu/m-pitch utilizing reliable microthin underfill technology for 3D stacked LSI |
|---|---|
| المؤلفون: | Umemoto, M., Tomita, Y., Morifuji, T., Ando, T., Sato, T., Takahashi, K. |
| المصدر: | 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) Electronic components and technology conference Electronic Components and Technology Conference, 2002. Proceedings. 52nd. :1454-1459 2002 |
| Relation: | Proceedings of 52nd Electronic Components and Technology Conference |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780374304 9780780374300 |
|---|---|
| تدمد: | 05695503 |
| DOI: | 10.1109/ECTC.2002.1008298 |