مؤتمر
The evaluation of copper migration during the die attach curing and second wire bonding process
| العنوان: | The evaluation of copper migration during the die attach curing and second wire bonding process |
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| المؤلفون: | Lin, T.Y., Davison, K.L., Leong, W.S., Chua, S., Pan, J.S., Chai, J.W., Toh, K.C., Tjiu, W.C. |
| المصدر: | 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) Electronic components and technology conference Electronic Components and Technology Conference, 2002. Proceedings. 52nd. :1586-1594 2002 |
| Relation: | Proceedings of 52nd Electronic Components and Technology Conference |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780374304 9780780374300 |
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| تدمد: | 05695503 |
| DOI: | 10.1109/ECTC.2002.1008319 |