مؤتمر
Interfacial fracture toughness test methodology for flip chip underfill encapsulant
| العنوان: | Interfacial fracture toughness test methodology for flip chip underfill encapsulant |
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| المؤلفون: | Pang, H.L.J., Zhang, X.R., Lim, C.H., Shi, X.Q., Wang, Z.P. |
| المصدر: | 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) Electronic components and technology conference Electronic Components and Technology Conference, 2002. Proceedings. 52nd. :1640-1644 2002 |
| Relation: | Proceedings of 52nd Electronic Components and Technology Conference |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780374304 9780780374300 |
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| تدمد: | 05695503 |
| DOI: | 10.1109/ECTC.2002.1008327 |