دورية أكاديمية
Reliability of PBGA assemblies under out-of-plane vibration excitations
| العنوان: | Reliability of PBGA assemblies under out-of-plane vibration excitations |
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| المؤلفون: | Yang, Q.J., Wang, Z.P., Lim, G.H., Pang, J.H.L., Yap, F.F., Lin, R.M. |
| المصدر: | IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 25(2):293-300 Jun, 2002 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 15213331 15579972 |
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| DOI: | 10.1109/TCAPT.2002.1010020 |