التفاصيل البيبلوغرافية
| العنوان: |
Reactive Die Bonding on LTCC Substrates – Analysis by CFD Simulation |
| المؤلفون: |
Wiss, Erik, Yuile, Adam, Schulz, Alexander, Muller, Jens, Wiese, Steffen |
| المصدر: |
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-5 Apr, 2023 |
| Relation: |
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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