التفاصيل البيبلوغرافية
العنوان: |
Stress Recovery in the Reduced Space for Parametric Reduced Models in Microelectronics |
المؤلفون: |
Zawra, I., Umunnakwe, C. B., Soestbergen, M. van, Rudnyi, E. B., Bechtold, T. |
المصدر: |
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-6 Apr, 2023 |
Relation: |
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
قاعدة البيانات: |
IEEE Xplore Digital Library |