التفاصيل البيبلوغرافية
| العنوان: |
Microstructure Analysis Based on 3D reconstruction Model and Transient Thermal Impedance Measurement of Resin-reinforced Sintered Ag layer for High power RF device |
| المؤلفون: |
Hu, X., Martina, H.A., Poelma, R.H., Huang, J.L., Rijckevorsel, H., Scholten, H., Smits, E.C.P., Van Driel, W.D., Zhang, G.Q. |
| المصدر: |
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-7 Apr, 2023 |
| Relation: |
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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