التفاصيل البيبلوغرافية
العنوان: |
Failure Prediction and Analysis of an IGBT Module for Industrial Applications Subjected to Passive and Power Cycling |
المؤلفون: |
Dudek, Rainer, Otto, Alexander, Doring, Ralf, Mathew, Anu, Liu, Xing, Rzepka, Sven |
المصدر: |
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-11 Apr, 2023 |
Relation: |
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
قاعدة البيانات: |
IEEE Xplore Digital Library |