التفاصيل البيبلوغرافية
| العنوان: |
Strain Measurements and Thermo-Mechanical Simulation of SnAgCu vs. low melting point alloy (LMPA-Q) solder joints |
| المؤلفون: |
Vandevelde, Bart, Labie, Riet, Lauwaert, Ralph, Dudek, Rainer, Gromala, Przemyslaw, Eichorst, Michael |
| المصدر: |
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-8 Apr, 2023 |
| Relation: |
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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