Thermo-Mechanical Super-Element of a Packaged-Chip Model for Re-Integrating Reduced State-Space Models into Finite Element Environment

التفاصيل البيبلوغرافية
العنوان:	Thermo-Mechanical Super-Element of a Packaged-Chip Model for Re-Integrating Reduced State-Space Models into Finite Element Environment
المؤلفون:	Umunnakwe, C. B., Zawra, I., Rudnyi, E. B., Niessner, M., Bechtold, T.
المصدر:	2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-6 Apr, 2023
Relation:	2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
قاعدة البيانات:	IEEE Xplore Digital Library