مؤتمر
Flip Chip Joining with Injection Molded Solder Technology
| العنوان: | Flip Chip Joining with Injection Molded Solder Technology |
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| المؤلفون: | Hisada, Takashi, Aoki, Toyohiro |
| المصدر: | 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2023 7th IEEE. :1-3 Mar, 2023 |
| Relation: | 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9798350332520 |
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| DOI: | 10.1109/EDTM55494.2023.10103044 |