التفاصيل البيبلوغرافية
| العنوان: |
Cross-Temperature Reliabilities in TLC 3D NAND Flash Memory: Characterization and Solution |
| المؤلفون: |
Guo, Yifan, Xie, Kenie, Fang, Xiaotong, Zhan, Xuepeng, Wu, Jixuan, Chen, Jiezhi |
| المصدر: |
2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2023 7th IEEE. :1-3 Mar, 2023 |
| Relation: |
2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
