مؤتمر
Cross-Temperature Reliabilities in TLC 3D NAND Flash Memory: Characterization and Solution
العنوان: | Cross-Temperature Reliabilities in TLC 3D NAND Flash Memory: Characterization and Solution |
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المؤلفون: | Guo, Yifan, Xie, Kenie, Fang, Xiaotong, Zhan, Xuepeng, Wu, Jixuan, Chen, Jiezhi |
المصدر: | 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2023 7th IEEE. :1-3 Mar, 2023 |
Relation: | 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) |
قاعدة البيانات: | IEEE Xplore Digital Library |
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