مؤتمر
Stress Migration of Aluminum Backside Interconnect in Xtacking®
| العنوان: | Stress Migration of Aluminum Backside Interconnect in Xtacking® |
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| المؤلفون: | Yang, Kang, Yang, Suhui, Ouyang, Yan, Yang, Shengwei, Han, Kun, He, Yi |
| المصدر: | 2023 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2023 IEEE International. :1-4 Mar, 2023 |
| Relation: | 2023 IEEE International Reliability Physics Symposium (IRPS) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781665456722 |
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| تدمد: | 19381891 |
| DOI: | 10.1109/IRPS48203.2023.10117817 |