Voltage Ramp Stress Test Optimization for Wafer Level Hot Carrier Monitoring in FinFET

التفاصيل البيبلوغرافية
العنوان: Voltage Ramp Stress Test Optimization for Wafer Level Hot Carrier Monitoring in FinFET
المؤلفون: Zhao, Ri-an, Koskinen, Matthew, Liu, Yang, Wan, Xinggong
المصدر: 2023 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2023 IEEE International. :1-6 Mar, 2023
Relation: 2023 IEEE International Reliability Physics Symposium (IRPS)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781665456722
تدمد:19381891
DOI:10.1109/IRPS48203.2023.10118309