Innovative Approaches for RG 3D NAND CMP Buff Steps Elimination with Fab Cost and Carbon Footprint Reduction : GF: Green Factory

التفاصيل البيبلوغرافية
العنوان:	Innovative Approaches for RG 3D NAND CMP Buff Steps Elimination with Fab Cost and Carbon Footprint Reduction : GF: Green Factory
المؤلفون:	Dong, Xinqiao, Yong, Yaolun, Wong, Hsuehchuang, McCabe, Russell, Mukherjee, Subhadeep, Yang, Yi
المصدر:	2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 2023 34th Annual. :1-5 May, 2023
Relation:	2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
قاعدة البيانات:	IEEE Xplore Digital Library