مؤتمر
Modeling thermal cycling and thermal shock tests for FCOB
العنوان: | Modeling thermal cycling and thermal shock tests for FCOB |
---|---|
المؤلفون: | Pang, J.H.L., Low, T.H. |
المصدر: | ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Thermal and thermomechanical phenomena in electronic systems Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on. :987-992 2002 |
Relation: | ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 0780371526 9780780371521 |
---|---|
DOI: | 10.1109/ITHERM.2002.1012564 |