Modeling thermal cycling and thermal shock tests for FCOB

التفاصيل البيبلوغرافية
العنوان: Modeling thermal cycling and thermal shock tests for FCOB
المؤلفون: Pang, J.H.L., Low, T.H.
المصدر: ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Thermal and thermomechanical phenomena in electronic systems Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on. :987-992 2002
Relation: ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:0780371526
9780780371521
DOI:10.1109/ITHERM.2002.1012564