High-Throughput Hardware Implementation for Haraka in SPHINCS+

التفاصيل البيبلوغرافية
العنوان: High-Throughput Hardware Implementation for Haraka in SPHINCS+
المؤلفون: Dai, Yueqin, Song, Yifeng, Tian, Jing, Wang, Zhongfeng
المصدر: 2023 24th International Symposium on Quality Electronic Design (ISQED) Quality Electronic Design (ISQED), 2023 24th International Symposium on. :1-6 Apr, 2023
Relation: 2023 24th International Symposium on Quality Electronic Design (ISQED)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9798350334753
9798350334746
تدمد:19483295
DOI:10.1109/ISQED57927.2023.10129310