مؤتمر
Novel Temporary Bonding/Debonding System Enabling Advanced Packaging Process
| العنوان: | Novel Temporary Bonding/Debonding System Enabling Advanced Packaging Process |
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| المؤلفون: | Miyazawa, Emi, Enomoto, Tetsuya, Akasu, Yuta, Sobue, Shogo, Nakamura, Yuki, Ogawa, Saeko, Kawamori, Takashi |
| المصدر: | 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :223-224 Apr, 2023 |
| Relation: | 2023 International Conference on Electronics Packaging (ICEP) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9784991191152 |
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| DOI: | 10.23919/ICEP58572.2023.10129696 |