مؤتمر
Novel Temporary Bonding/Debonding System Enabling Advanced Packaging Process
العنوان: | Novel Temporary Bonding/Debonding System Enabling Advanced Packaging Process |
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المؤلفون: | Miyazawa, Emi, Enomoto, Tetsuya, Akasu, Yuta, Sobue, Shogo, Nakamura, Yuki, Ogawa, Saeko, Kawamori, Takashi |
المصدر: | 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :223-224 Apr, 2023 |
Relation: | 2023 International Conference on Electronics Packaging (ICEP) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9784991191152 |
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DOI: | 10.23919/ICEP58572.2023.10129696 |