مؤتمر
Thermal Impact of Solder Voids under Chip of Power Semiconductors
العنوان: | Thermal Impact of Solder Voids under Chip of Power Semiconductors |
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المؤلفون: | Tabakoya, T., Arai, M., Inoue, D., Murakami, K., Matsuo, K., Tsujimura, T. |
المصدر: | 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :99-100 Apr, 2023 |
Relation: | 2023 International Conference on Electronics Packaging (ICEP) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9784991191152 |
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DOI: | 10.23919/ICEP58572.2023.10129724 |