مؤتمر
Thermal Impact of Solder Voids under Chip of Power Semiconductors
| العنوان: | Thermal Impact of Solder Voids under Chip of Power Semiconductors |
|---|---|
| المؤلفون: | Tabakoya, T., Arai, M., Inoue, D., Murakami, K., Matsuo, K., Tsujimura, T. |
| المصدر: | 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :99-100 Apr, 2023 |
| Relation: | 2023 International Conference on Electronics Packaging (ICEP) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
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