مؤتمر
Temperature-Aware Sizing of Multi-Chip Module Accelerators for Multi-DNN Workloads
| العنوان: | Temperature-Aware Sizing of Multi-Chip Module Accelerators for Multi-DNN Workloads |
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| المؤلفون: | Shukla, Prachi, Aguren, Derrick, Burd, Tom, Coskun, Ayse K., Kalamatianos, John |
| المصدر: | 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE) Design, Automation & Test in Europe Conference & Exhibition (DATE), 2023. :1-6 Apr, 2023 |
| Relation: | 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 15581101 |
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| DOI: | 10.23919/DATE56975.2023.10137047 |