دورية أكاديمية
Thermal–Electrical Modeling and Co-Optimization of a Half-Bridge Power Module With Silver- Sintered Molybdenum Packaging
| العنوان: | Thermal–Electrical Modeling and Co-Optimization of a Half-Bridge Power Module With Silver- Sintered Molybdenum Packaging |
|---|---|
| المؤلفون: | Yang, Y., Zhou, L., Zayed, O., Alizadeh, M., Stevanovic, D., Narimani, M., Emadi, A. |
| المصدر: | IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 38(9):11277-11289 Sep, 2023 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 08858993 19410107 |
|---|---|
| DOI: | 10.1109/TPEL.2023.3281417 |